Title:
MOLDING SHEET AND PACKAGING CONTAINER
Document Type and Number:
Japanese Patent JP2023138387
Kind Code:
A
Abstract:
To provide a molding sheet which is excellent in impact resistance under refrigeration environment, exhibits excellent mechanical strength even if a used resin amount is reduced, and enables thinning of the sheet, and a molded article using the same.SOLUTION: A molded article is obtained by thermoforming a laminated sheet where surface layers 3 and 3' are provided on both surfaces of a molding sheet as a base material layer 1 containing a polyolefin resin, and a talc dispersing the resin as a matrix as essential components, in which the talc has an average particle diameter (D50) of 2-8 μm and an aspect ratio of 30-50.SELECTED DRAWING: Figure 1
Inventors:
ITAZAKI KEI
KARAKAWA TAKANORI
KARAKAWA TAKANORI
Application Number:
JP2023033089A
Publication Date:
October 02, 2023
Filing Date:
March 03, 2023
Export Citation:
Assignee:
FP CORP
International Classes:
C08J5/18; B65D65/40; C08K3/34; C08L23/06; C08L53/00; C08L101/00
Attorney, Agent or Firm:
Yoshihisa Saito
Previous Patent: Media processing device and image forming device
Next Patent: Multi-tenant multi-function device not connected to the network
Next Patent: Multi-tenant multi-function device not connected to the network