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Title:
MOLDING SYSTEM
Document Type and Number:
Japanese Patent JP2016002587
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a molding system in which a gas supply portion of a molding device does not disturb a metal pipe material to be carried from a preliminarily molding device to the molding device and a metal pipe to be carried from the molding device to a cutting device.SOLUTION: When horizontal directions orthogonal to each other at a center of a molding device 10 that molds a metal pipe are set as a direction X and a direction Y, a preliminarily molding device 2, a molding device 10 and a cutting device 3 are arranged along the direction Y, a gas supply mechanism 40 included in the molding device 10 is arranged along the direction X which is separate from the center of the molding device 10 and orthogonal to the direction Y, so that the gas supply mechanism 40 is configured so as not to be arranged on a carrying pipe route from the preliminarily molding device 2 to the molding device 10 aligned in the direction Y and on a carrying pipe route from the molding device 10 to the cutting device 3 aligned in the direction Y, which prevents the gas supply mechanism 40 from disturbing a pipe to be carried.

Inventors:
ISHIZUKA MASAYUKI
SAIGA MASAYUKI
UENO KIJO
KOMATSU TAKASHI
Application Number:
JP2014126360A
Publication Date:
January 12, 2016
Filing Date:
June 19, 2014
Export Citation:
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Assignee:
SUMITOMO HEAVY INDUSTRIES
LINZ RES ENGINEERING CO LTD
International Classes:
B21D26/033; B30B13/00
Domestic Patent References:
JP2008529798A2008-08-07
JP2001355765A2001-12-26
JP2000246361A2000-09-12
JPH06292929A1994-10-21
Foreign References:
US20020003011A12002-01-10
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Yasuki Yanagi



 
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