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Title:
MOLDING TOOL FOR PLASTIC PART FOR PHOTOGRAPHIC SENSITIZED MATERIAL
Document Type and Number:
Japanese Patent JP2003080523
Kind Code:
A
Abstract:

To prevent the molding face of a molding tool from being corroded and thereby, upgrade the durability, in the molding tool made of a beryllium copper alloy to be used for injection-molding plastic parts for a photographic sensitized material.

In the molding tool for plastic parts for a photographic sensitized material requiring sufficient durability, the molding faces 14a and 15 of the molding tool made of a beryllium copper alloy are covered by a coating layer 21 including a boron-containing layer. This coating layer 21 is preferably constituted of a boron carbide layer formed on the molding faces 14a and 15 and a boron nitride layer formed on the upper surface of the boron carbide layer. The overall thickness of the coating layer 21 is held down to 2 μm.


Inventors:
SUZUKI TAKASHI
Application Number:
JP2001273146A
Publication Date:
March 19, 2003
Filing Date:
September 10, 2001
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
B29C33/38; (IPC1-7): B29C33/38
Attorney, Agent or Firm:
Kazunori Kobayashi