Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDING WITH ELECTROMAGNETIC SEALING PROPERTIES AND MOLDED MATERIAL USING SAME SHEET
Document Type and Number:
Japanese Patent JPH02125730
Kind Code:
A
Abstract:

PURPOSE: To make a conductive layer hard to be broken by the stress applied at the time of molding by laminating a conductive laminate sheet, a heat fusion type bonding agent layer of specific thickness and a thermoplastic synthetic resin sheet.

CONSTITUTION: A conductive laminate sheet A is provided with conductivity by means of a metal film 1 in a base constitution, and a number of creases are generated in the metal film 1 by the contraction of the heat shrinkable synthetic resin film 2. Accordingly, when a sheet for molding is molded, even if the conductive laminate sheet A is stretched, the creases of the metal film are also stretched to prevent the metal film constituting the conductive layer from getting broken. Also, at the time of molding, although the stretching margin of the conductive laminate sheet A and a thermoplastic synthetic resin sheet C are different, a heat fusion type bonding agent layer B of 30μm-200μm thickness is provided between the two and fluidity is generated in the heat fusion type bonding agent B by the heat of molding and the difference of stretches generated between the conductive laminate sheet A and the thermoplastic synthetic resin sheet C is absorbed by said heat fusion type bonding agent layer B to manufacture a molded product of good appearance.


Inventors:
NAKANO TOSHIHIKO
MAKIMOTO SHOICHI
NANRI HIROYOSHI
OGAWA KAZUHIRO
FUKUDA HARUHIRO
Application Number:
JP10629889A
Publication Date:
May 14, 1990
Filing Date:
April 25, 1989
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOYO ALUMINIUM KK
TSUTSUNAKA PLASTIC KOGYO
International Classes:
B32B15/08; B29B11/14; H05K9/00; (IPC1-7): B29B11/14; B32B15/08
Attorney, Agent or Firm:
Bunji Kamada



 
Previous Patent: JPH02125729

Next Patent: METAL FOIL LINED LAMINATE