MOLECULARLY ORIENTED SYNTHETIC RESIN AND CLAD THEREOF
Document Type and Number:
Japanese Patent JP2002308936
To obtain a synthetic resin composition exhibiting satisfactory thermal adaptability to a substrate.
The synthetic resin composition comprises a network polymer having a linear thermal expansion coefficient in two mutually perpendicular directions below the glass transition temperature at least three times smaller than that in a third direction extending perpendicularly to these two directions and having a helical orientation having a helical axis in the same direction as the third direction.
Heynderickx, Ingrid E. J. R.
Broer, Dirk J.
Mol, Grietje N.
October 23, 2002
October 16, 1990
KONINKL PHILIPS ELECTRONICS NV
G02B6/12; C08F20/30; C08F299/02; C08J3/00; C08J5/00; C08L33/04; C08L101/00; C09K19/38; G02B1/04; G02B5/26; G02B5/30; G02B6/00; G02F1/00; (IPC1-7): C08F20/30; C08J5/00; G02B1/04; G02B5/26; G02B5/30; G02B6/12