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Patent Searching and Data


Title:
MOLTEN SOLDER COATING APPARATUS AND MOLTEN SOLDER COATING METHOD
Document Type and Number:
Japanese Patent JP2008088035
Kind Code:
A
Abstract:

To provide a molten solder coating apparatus and a molten solder coating method for forming a solder layer on a glass substrate, for forming a solder layer having satisfactory interfacial strength and having little variation in the interfacial strength.

The molten solder coating apparatus coats one side of a glass substrate with molten solder and includes: a molten solder feeding means provided with a feeding part for feeding molten solder to one side of a glass substrate; a scraping means provided with a scraping part abutted against one side of the glass substrate; and a scraping means movable synchronously with the molten solder feeding means. The feeding part is arranged at a position where the feeding part can feed the molten solder to the abutted parts between the scraping part and the glass substrate.


Inventors:
ITO MOTOMICHI
CHIWATA NOBUHIKO
YAMADA MINORU
Application Number:
JP2006273152A
Publication Date:
April 17, 2008
Filing Date:
October 04, 2006
Export Citation:
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Assignee:
HITACHI METALS LTD
International Classes:
C03C17/06; B05C11/02; B05D7/00; B05D7/24; B23K1/00; B23K1/19; B23K3/06; B23K101/36