Title:
研磨加工ステージにおける半導体基板の監視機器および監視方法
Document Type and Number:
Japanese Patent JP5037974
Kind Code:
B2
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Inventors:
Eiichi Yamamoto
Application Number:
JP2007064264A
Publication Date:
October 03, 2012
Filing Date:
March 14, 2007
Export Citation:
Assignee:
Okamoto Machine Tool Co., Ltd.
International Classes:
B24B49/12; B24B37/013; B24B37/04; B24B51/00; H01L21/304
Domestic Patent References:
| JP3507794B2 | ||||
| JP2007019385A | ||||
| JP2005294378A | ||||
| JP2006203132A | ||||
| JP2002166360A | ||||
| JP2000254857A | ||||
| JP2005098773A | ||||
| JP2001284300A | ||||
| JP2002346920A |