Title:
MORTAL LAMINATED TO ALC BOARD
Document Type and Number:
Japanese Patent JP3472330
Kind Code:
B2
Abstract:
PURPOSE: To reduce the generation of cracks in an ALC board in a process for hardening a mortal by laminating a specific mortal, when the mortal in a considerable thickness is laminated to the ALC board as a floor board.
CONSTITUTION: In the conventional technique for finishing a floor, a mortal is laminated in a thickness of maximum 15 mm to an ALC board. But, when the rigidity or sound insulation of the floor is enhanced, the mortal is laminated in a thickness of ≥15mm. When a conventional mortal is used, the hardened product of the mortal is contracted by the evaporation of water on the hardening of the mortal. Especially, in a process for hardening the mortal on the ALC board, the ALC board is warped, and cracks are sometimes generated between reinforcing steel layers and other layers in the ALC board. For solving theme, a mortal comprising 100 pts.wt. of sand, 15-25 pts.wt. of high early strength Portland cement, 5-15 pts.wt. of spherical fly ash, 0.5-2.5 pts.wt. of polypropylene glycol having a mol.wt. of 100-800, 2.5 pts.wt. of an expanding agent (e.g. containing unslaked lime and calcium sulfoaluminate as main components), and water is used.
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Inventors:
Mitsuo Suda
Application Number:
JP35137993A
Publication Date:
December 02, 2003
Filing Date:
December 16, 1993
Export Citation:
Assignee:
Clion Co., Ltd.
International Classes:
E04F15/12; B32B13/04; C04B18/08; C04B24/32; C04B28/04; C04B41/62; C04B41/65; (IPC1-7): C04B41/65; C04B18/08; C04B24/32; C04B28/04; C04B41/62
Other References:
【文献】コンクリート便覧,日本,技報堂出版株式会社,1978年 7月20日,1版3刷,151頁