Title:
MOTOR COIL SUBSTRATE AND MOTOR
Document Type and Number:
Japanese Patent JP2021197446
Kind Code:
A
Abstract:
To provide a highly efficient motor coil substrate.SOLUTION: A motor coil substrate 20 according to an embodiment is formed by winging a coil substrate 201 having a flexible substrate 22 having one end 22L and the other end 22R and a plurality of coils C formed on the flexible substrate 22. The motor coil substrate 20 is formed by winding the coil substrate 201 three times, and a third flexible substrate 22E on the third lap is wound outside a second flexible substrate 22O on the second lap, and the first flexible substrate 22I and the second flexible substrate 22O have the coil C, the third flexible substrate 22E does not have the coil, and an adhesive layer 30 is provided on the third flexible substrate 22E.SELECTED DRAWING: Figure 2
Inventors:
MORITA HARUHIKO
MIWA HITOSHI
KATO SHINOBU
YOKOMAKU TOSHIHIKO
KATO HISASHI
HIRASAWA TAKAHISA
MURAKI TETSUYA
FURUNO TAKAYUKI
MIWA HITOSHI
KATO SHINOBU
YOKOMAKU TOSHIHIKO
KATO HISASHI
HIRASAWA TAKAHISA
MURAKI TETSUYA
FURUNO TAKAYUKI
Application Number:
JP2020102862A
Publication Date:
December 27, 2021
Filing Date:
June 15, 2020
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K1/16; H01F5/00; H02K3/26
Attorney, Agent or Firm:
Akito Tashita
Previous Patent: Power module and manufacturing method of power module
Next Patent: Semiconductor device
Next Patent: Semiconductor device