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Title:
MOUNT METHOD FOR SOLID-STATE COLOR IMAGE PICKUP DEVICE
Document Type and Number:
Japanese Patent JPH06133322
Kind Code:
A
Abstract:

PURPOSE: To provide the mount method of the solid-state image pickup device in which highly accurate assembly and mass-production are facilitated at a low cost with miniaturization by simplifying the mount structure of the solid- state color image pickup device onto a lens barrel

CONSTITUTION: A liquid ultraviolet ray curing adhesives is interposed among prism members 3a, 3b, 3c and among the prism members 3a, 3b, 3c and among solid-state image pickup elements 4a, 4b, 4c of a solid-state color image pickup device and they are tentatively assembled and a liquid ultraviolet ray curing adhesives is applied between the solid-state image pickup device assembled tentatively and a mount base 1 and they are tentatively assembled. A reference chart 8 is picked up by the solid-state image pickup elements 4a, 4b, 4c via a lens barrel 5 incorporating a camera lens to detect the position, and after the optical length of the solid-state image pickup elements 4a, 4b, 4c and the longitudinal axis and the lateral axis are positioned relatively to fix the entire components in the lump by emitting an ultraviolet ray to the adhesives.


Inventors:
ITO TATSUO
Application Number:
JP27988092A
Publication Date:
May 13, 1994
Filing Date:
October 19, 1992
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H04N5/335; H04N5/372; H04N9/09; H04N9/097; (IPC1-7): H04N9/097; H04N5/335; H04N9/09
Attorney, Agent or Firm:
Akira Kobiji (2 outside)



 
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