To provide a method and an apparatus wherein an interconnection terminal or a test socket is not damaged and a signal distortion is not introduced in the method and the apparatus wherein an electronic device is mounted and held.

In a socket 20 for the test and/or the burn-in of a high-frequency electronic device package 10, parallel ends are connected by support beams 43, ends on one side are passed through a first guide means so as to be extened into a cavity 26 in the socket, and ends on the other side are formed of contact pins 40 which are passed through a second guide means separated from the first guide means. Outside ends 42 of the contact pins are arranged so as to come into contact with input/output lands of an electronic circuit such as a burn-in board or the like, and inside ends 41 are arranged so as to come into contact with input/output lands or lands 11 on the package 10. The length and the size of the contact pins are minimized, and the signal distortion is reduced.