Title:
フィラメント状連結体の装着装置
Document Type and Number:
Japanese Patent JP7266410
Kind Code:
B2
Abstract:
To improve a supporting structure of a mounting device, especially a head part carrying arm, for filamentary connections for mounting filament in a ring shape on an object by having a connection to be engaged by an engagement claw.SOLUTION: A mounting device of a filamentary connection L which has a trigger lever 3 in front of a pair of hollow grips 2c on the left and right, at least has a parallel link mechanism that works by activation of the trigger lever, and a head part carrying arm 4 of the filamentary connection that works by the parallel link mechanism is structured such that with bearings in which the supporting structure of the head part carrying arm is fitted into the through hole which has formed on the left and right bases inside the body, being the support shaft, the head part carrying arm is supported by the left and right bases.SELECTED DRAWING: Figure 6
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Inventors:
Koji Sano
Application Number:
JP2019003294A
Publication Date:
April 28, 2023
Filing Date:
January 11, 2019
Export Citation:
Assignee:
Tosuka Banock Co., Ltd.
International Classes:
B65C7/00; B65B13/18
Domestic Patent References:
| JP3710123B2 | ||||
| JP55163113A | ||||
| JP2009085233A | ||||
| JP2009174721A |
Foreign References:
| CN106314863A |
Attorney, Agent or Firm:
Akiyoshi Sato
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