Title:
MOUNTING DEVICE FOR THERMOELECTRIC MODULE AND METHOD FOR CONTROLLING TEMPERATURE THEREOF
Document Type and Number:
Japanese Patent JP3820942
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermoelectric module mounting device as well as a method for controlling its temperature, capable of individually controlling temperature of a plurality of electronic parts, with a small mounting area and less assembling processes.
SOLUTION: Related to the thermoelectric module mounting device, a plurality of thin-film heaters 2 of temperature adjusting members, and a thermistor 3 which detects the temperature of a bulk-type thermoelectric module 1 are formed on the bulk-type thermoelectric module 1. A base substrate 4 of Cu-W is formed on the thin-type heater 2 through an insulator, and a thermistor 5 and an LD 6 are formed on the base substrate 4. The thin-film heaters 2 are formed by pasting a nichrome sheet to the bulk-type thermoelectric module 1, or the like with two gold wires 8 connected to each thin-film heater 2. After controlling electrification to the bulk-type thermoelectric module 1 based on the result of temperature detection of the thermistor 3, the thin-film heater 2 is controlled for electrification based on the result of temperature detection of the thermistor 5.
Inventors:
Katsuhiko Onoe
Shunji Hoshi
Kensaburo Iijima
Shunji Hoshi
Kensaburo Iijima
Application Number:
JP2001262267A
Publication Date:
September 13, 2006
Filing Date:
August 30, 2001
Export Citation:
Assignee:
Yamaha Corporation
International Classes:
H01L23/38; H05B3/00; G05D23/24; H01L23/34; H01L35/16; H01L35/28; H01L35/32; H01S5/024; (IPC1-7): H01L23/38; G05D23/24; H01L23/34; H01L35/16; H01L35/28; H01L35/32; H01S5/024; H05B3/00
Domestic Patent References:
| JP2000244048A | ||||
| JP59204292A | ||||
| JP10233548A | ||||
| JP61252681A |
Attorney, Agent or Firm:
Masanori Fujimaki