Title:
MOUNTING OF ELECTRICAL COMPONENT
Document Type and Number:
Japanese Patent JPH0613743
Kind Code:
A
Abstract:
PURPOSE: To prevent the generation of a solder ball during reflow-soldering of electrical components.
CONSTITUTION: In a method of mounting an electric component, in which the electric component 5 is reflow-soldered on a board by the use of cream solder, a thin film 8 of the same composition as that of the solder is formed on a solder land and its peripheral part and the like on a pattern of the board on which a solder resist 3 is printed and after that, the cream solder is printed. Thereby, reflow-soldering of an IC provided with leads of a narrow lead pitch of 0.3mm becomes possible in addition to a VSOP and a VQFP, which are each provided with leads of a lead pitch of 0.5mm.
Inventors:
IWASHITA TAKESHI
Application Number:
JP16627492A
Publication Date:
January 21, 1994
Filing Date:
June 24, 1992
Export Citation:
Assignee:
SONY CORP
International Classes:
H01L23/50; H05K3/34; (IPC1-7): H05K3/34; H01L23/50
Attorney, Agent or Firm:
Mitsuo Takahashi
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