Title:
【発明の名称】回路基板への電子コンポーネントの実装
Document Type and Number:
Japanese Patent JPH09508241
Kind Code:
A
Abstract:
The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.
Inventors:
Handross, igo, wai
Matthew, Gaetan, El
Eldridge, Benjamin, N
Gary, Groove, W
Dosair, thomas, h
Matthew, Gaetan, El
Eldridge, Benjamin, N
Gary, Groove, W
Dosair, thomas, h
Application Number:
JP51630796A
Publication Date:
August 19, 1997
Filing Date:
November 13, 1995
Export Citation:
Assignee:
Form Factor, Incorporated
International Classes:
G01R1/073; B23K1/00; B23K20/00; B23K31/02; C23C18/16; C25D5/16; C25D7/12; G01R1/04; G01R1/06; G01R1/067; G01R31/26; G01R31/28; H01L21/00; H01L21/48; H01L21/56; H01L21/58; H01L21/60; H01L21/603; H01L21/607; H01L21/66; H01L21/68; H01L23/02; H01L23/12; H01L23/32; H01L23/48; H01L23/485; H01L23/49; H01L23/498; H01L23/538; H01L25/065; H01L25/07; H01L25/16; H01L25/18; H01R9/00; H01R12/16; H01R12/71; H01R13/05; H01R13/24; H01R29/00; H01R33/74; H01R33/76; H05H1/18; H05K1/18; H05K3/24; H05K3/30; H05K3/32; H05K3/40; H05K7/10; C25D5/08; C25D5/22; C25D21/02; H01R107/00; H05K1/14; H05K3/20; H05K3/34; H05K3/36; (IPC1-7): H01L21/60; H01L23/12
Attorney, Agent or Firm:
Kaoru Furuya (2 outside)