PURPOSE: To easily correct a temporarily clamped position and to prevent improper soldering by mounting electronic components on an electrically wired insulating substrate with a both-side adhesive tape.

CONSTITUTION: An electronic component, such as a flat package type IC 2 of a chip component is secured with a both-side adhesive tape 3 on an electrically wired insulating substrate, such as a glass epoxy printed substrate 1, and the terminal 4 of the IC 2 is bonded to be mounted by a solder 6 to a land 5 formed on the substrate 1. According to this method, the correction of the mounting displacement can be easily corrected to be efficiently soldered.