Title:
実装装置
Document Type and Number:
Japanese Patent JP7117805
Kind Code:
B2
Abstract:
The present invention provides a mounting apparatus, including a bonding stage holding a substrate on which a semiconductor chip is arranged; a base stand; a mounting head mounted with a pressing tool that presses the semiconductor chip on the substrate; and a film arranging mechanism provided on the base stand and moving a cover film along the bonding stage to arrange the cover film between the semiconductor chip pressed by the substrate and the pressing tool. The film arranging mechanism includes film guides guiding the cover film and defining a height with respect to the bonding stage; and lifting mechanisms connected to the film guides via springs and lifting and lowering the film guides with respect to the bonding stage.
Inventors:
jungie rob alexander
Kohei Seyama
Kohei Seyama
Application Number:
JP2021562898A
Publication Date:
August 15, 2022
Filing Date:
July 16, 2020
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/60
Domestic Patent References:
| JP200916544A | ||||
| JP200712641A |
Foreign References:
| WO2009128206A1 | ||||
| WO2019107395A1 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office