Title:
実装装置
Document Type and Number:
Japanese Patent JP7293477
Kind Code:
B2
Abstract:
A mounting device comprises a substrate stage, a mounting head, an elevating unit, a recognition mechanism, and a control unit. The recognition mechanism acquires position information about a chip recognition mark and a substrate recognition mark using an imaging unit. The control unit calculates an amount of positional deviation between a chip component and a substrate from the position information about the chip recognition mark and the substrate recognition mark, and performs alignment by driving the mounting head and/or the substrate stage according to the amount of the positional deviation. The chip component and the substrate are brought closer with each other and the alignment is performed in a state in which the imaging unit simultaneously images the chip recognition mark and the substrate recognition mark within a depth of field, after which the chip component and the substrate are brought into close contact with each other.
Inventors:
Katsumi Terada
Takeshi Hamakawa
Haru Takashi
Taiji Tamura
Miyu Tajima
Takashi Yoneda
Takeshi Hamakawa
Haru Takashi
Taiji Tamura
Miyu Tajima
Takashi Yoneda
Application Number:
JP2022151400A
Publication Date:
June 19, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
Toray Engineering Co., Ltd.
International Classes:
H01L21/52; H05K13/04
Domestic Patent References:
| JP2010283010A | ||||
| JP2008109057A | ||||
| JP2000276233A | ||||
| JP2007294611A |
Foreign References:
| WO2020044580A1 |