Title:
MOUNTING OF HEADER ASSEMBLY OF ELECTRIC CONNECTOR TO MOUNTING SURFACE OF ELECTRIC DEVICE AND MOUNTING THEREOF
Document Type and Number:
Japanese Patent JPH06251851
Kind Code:
A
Abstract:
PURPOSE: To provide a device and a method to install a header assembly on an installing surface of an electric device such as a printed circuit board by using a vacuum suction nozzle. CONSTITUTION: A method and a device are provided to install a header assembly 10 on an installing surface 12 of an electric device 14 by using a vacuum suction nozzle 18. The header assembly has an insulating housing 20 arranged in the vicinity of the installing surface and plural terminals 22 installed in this housing 20, and these terminals have tail parts 24 mutually connected to a circuit 28 of the electric device and pin parts 26 projecting from the housing. A slidingly movable cover 16 has plural pin receiving passages 30 to receive the free ends 26a of the pin parts of at least several terminals. When the pin parts are tightly fitted to the passages, a cover and the header assembly 10 can be installed together in the electric device, and after the tail parts 24 are connected to the circuit of the electric device, the cover can be slidingly removed from the terminals. The cover has a smooth upper surface area 32 having the size sufficient to engage with the vacuum suction nozzle 18 to operate and positionally set the header assembly and the cover.
Inventors:
AU YONGU KUUI SHIONGU
Application Number:
JP3646394A
Publication Date:
September 09, 1994
Filing Date:
February 09, 1994
Export Citation:
Assignee:
MOLEX INC
International Classes:
H01R12/57; H01R12/71; H01R43/02; H01R13/44; H01R13/443; H01R43/20; H05K3/34; H05K13/00; H05K13/04; (IPC1-7): H01R43/20; H01R43/02
Attorney, Agent or Firm:
Hiroshi Ikeda