Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP2023111175
Kind Code:
A
Abstract:
To provide a technique of collecting an electronic component determined to be not mountable appropriately for each type.SOLUTION: A component mounting device mounts a plurality of kinds of electronic components on a substrate. The component mounting device comprises: a nozzle that sucks the electronic component; a determination part that determines whether or not the electronic component sucked by the nozzle can be mounted; and a component collection part that collects the electronic component determined to be noe mountable in the determination part, includes a first collection part that collects an electronic component of a first type and a second collection part that collects an electronic component of a second type different from the electronic component of the first type, and is configured so that the height of a bottom surface of the first collection part and the height of a bottom surface of the second collection part can be changed, respectively.SELECTED DRAWING: Figure 4
Inventors:
ANDO RYOSUKE
Application Number:
JP2022012881A
Publication Date:
August 10, 2023
Filing Date:
January 31, 2022
Export Citation:
Assignee:
FUJI CORP
International Classes:
H05K13/04
Attorney, Agent or Firm:
Patent Attorney Corporation Kaiyu International Patent Office