To provide a mounting method for chip element, with which short- circuiting caused by a conductive adhesive is prevented, and to provide a crystal oscillator for improving productivity which uses this method.
Concerning the mounting method for chip element for connecting a chip element, which has packaging terminals on both terminal sides, to each of terminal electrodes of a substrate by the conductive adhesive, an insulated adhesive is provided between the packaging terminals. Also, a groove having a protruding part on the center is provided between the terminal electrodes of the substrate, and the insulated adhesive is provide on the surface of the protruding part. Furthermore, the chip elements are capacitors, and the crystal oscillator is constituted by applying the mounting method therefor.
NEGISHI SUSUMU
SAKABA YASUO
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