PURPOSE: To facilitate the automation of the mounting process by providing two sets of highly conductive pad to one conductive face of a chip type inductor and using a high conduction wire so as to connect each pad and a circuit pattern of a base side by the wire bonding method thereby eliminating the need for soldering lead terminals.
CONSTITUTION: A connection pattern 17 is formed fo two parts on the base 16 while clipping a dielectric resonator 11 in front and in rear and each pad 18 of the dielectric resonator 11 and the connection pattern 17 are connected by a gold-made wire 15. In case of mounting, two pads 18 are formed on a metallic film 13 of the dielectric resonator 11 by printing and the dielectric resonator 11 is fixed on a dice bonding pattern 19 of the base 18 by soldering or the like. Then the wire 15 is used to connect each pad 18 and the connection pattern 17 by the wire bonding method to form the circuit. The processes above are attained by automation.
ARAKAWA KUNIO
KAWAKAMI IZUMI
