Title:
MOUNTING METHOD FOR FILM SHAPED DIFFUSING SOURCE
Document Type and Number:
Japanese Patent JPS5626430
Kind Code:
A
Abstract:
PURPOSE:To eliminate misalingnment and poor contact completely, by placing a mounting table on a diffusing boat, alternately stacking film shaped diffusing sources and wafers, and loading a weight. CONSTITUTION:On the diffusing boat 1, is placed the mounting table 2a whose shape is such that semiconductor wafers 4 are not extruded. On the mounting table 2a, an N type film shaped diffusing source 3, a wafer 4, a P type film shaped diffusing source 5, and a wafer 4 are sequentially stacked. Then, the weight 2b whose shape is such that the wafers 4 are not extruded is placed thereon. In this method, since a uniformly averaged load W is applied between the wafers 4 and the diffusing sources 3 and 5, the misalignment and poor contact between the wafers 4 and the diffusing sources 3 and 5 are completely eliminated. Therefore, semiconductor devices having uniform and more stabilized quality can be obtained.
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Inventors:
OOKUBO SHIZUTAKA
Application Number:
JP10204579A
Publication Date:
March 14, 1981
Filing Date:
August 09, 1979
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/225; H01L21/223; (IPC1-7): H01L21/223