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Title:
MOUNTING METHOD OF FLUX AND SOLDER BALL, AND APPLICATION METHOD OF FLUX
Document Type and Number:
Japanese Patent JP3204072
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To suppress any operational error in the application of a flux to a solder ball even though a bubble is generated in the flux and reduce the variation of the application quantity of the flux to the solder ball, by making the flux contain a defoaming agent.
SOLUTION: When making a flux 2 contain a defoaming agent, even though a bubble 11 is generated in the flux 2, the bubble 11 is extinguished by the action of the defoaming agent on it to bring the top surface of the flux 2 into a state of no irregularity. Thereby, when a holding head 8 holds a solder ball 10 in its sucking hole 8a to lower to a predetermined position, the flux 2 is applied to the lower portion of the solder ball 10. Also, since the top surface of the flux 2 is made flat, the under surface of the holding head 8 does not abut on the flux 2 to eliminate the sticking of the flux 2 on the holding head 8. Therefore, even though the bubble 11 is generated in the flux 2, any mistake is not accompanied by the bubble 11 to make the application of the flux 2 to the solder ball 10 and the transferring of the solder ball 10 to a soldering place possible.


Inventors:
Shoji Sakemi
Seiji Yoshinaga
Application Number:
JP6236596A
Publication Date:
September 04, 2001
Filing Date:
March 19, 1996
Export Citation:
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Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23K35/363; H05K3/34; (IPC1-7): H05K3/34; B23K35/363
Domestic Patent References:
JP7108398A
JP62199292A
JP7290277A
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)