PURPOSE: To increase the strength of a connector, to improve reliability, and to improve mass productivity by applying a surface mounting method by connecting by soldering the tonguelike electrode of an element engaged within an element containing hole planely oppositely to the substrate electrode of a substrate.

CONSTITUTION: Cream solder is printed on substrate electrodes 5a, 5b, and a crystal vibrator 6 is engaged within an element containing hole 4 to connect tonguelike electrodes 9a, 9b to corresponding electrodes 5a, 5b. Then, the solder reflows by heating, and a connector is soldered at 10. Thus, after an IC chip 2 is mounted by soldering, an IC card is composed.