To prevent a short circuit even in long-time operation by press- contacting positive and negative electrodes against wiring electrodes, using a pasty bonding material.
A wiring board 20 has an insulated substrate 22, on which a wiring electrode 21 having a specified pattern is placed. To the wiring electrode 21, a bonding material 25 containing no silver is placed by using a placing means 26. Next, a light emitting element 1 is moved to a specified position directly above the wiring board 20 by using a moving means 27 such as a collet, and is held with the bonding material 25 so that a second positive electrode and a negative element of the light emitting element 1 are opposite to the wiring electrode 21. The light emitting element 1 is lowered from a specified position so that the second electrode and negative electrode are press-contacted to the wiring electrode 21 through the bonding material 25 for connection.
TAKAOKA YOSHIKAZU
JPH118414A | 1999-01-12 | |||
JPH11186598A | 1999-07-09 | |||
JPH1197742A | 1999-04-09 | |||
JPH10107325A | 1998-04-24 | |||
JPH03205162A | 1991-09-06 | |||
JPH11214419A | 1999-08-06 | |||
JPH1187771A | 1999-03-30 | |||
JPH104126A | 1998-01-06 |