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Title:
MOUNTING METHOD OF NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT
Document Type and Number:
Japanese Patent JP2001085749
Kind Code:
A
Abstract:

To prevent a short circuit even in long-time operation by press- contacting positive and negative electrodes against wiring electrodes, using a pasty bonding material.

A wiring board 20 has an insulated substrate 22, on which a wiring electrode 21 having a specified pattern is placed. To the wiring electrode 21, a bonding material 25 containing no silver is placed by using a placing means 26. Next, a light emitting element 1 is moved to a specified position directly above the wiring board 20 by using a moving means 27 such as a collet, and is held with the bonding material 25 so that a second positive electrode and a negative element of the light emitting element 1 are opposite to the wiring electrode 21. The light emitting element 1 is lowered from a specified position so that the second electrode and negative electrode are press-contacted to the wiring electrode 21 through the bonding material 25 for connection.


Inventors:
TOYODA TATSUNORI
TAKAOKA YOSHIKAZU
Application Number:
JP26192599A
Publication Date:
March 30, 2001
Filing Date:
September 16, 1999
Export Citation:
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Assignee:
NICHIA KAGAKU KOGYO KK
International Classes:
H01L33/32; H01L33/62; (IPC1-7): H01L33/00
Domestic Patent References:
JPH118414A1999-01-12
JPH11186598A1999-07-09
JPH1197742A1999-04-09
JPH10107325A1998-04-24
JPH03205162A1991-09-06
JPH11214419A1999-08-06
JPH1187771A1999-03-30
JPH104126A1998-01-06
Attorney, Agent or Firm:
Toyosu Yasuhiro (1 person outside)