PURPOSE: To provide a semiconductor chip mounting method capable of mounting a semiconductor chip having an electrode installed at a narrower pitch.
CONSTITUTION: This semiconductor chip mounting method is provided with a first process which loads a semiconductor chip 15 on a recessed part 17a on a board 17 and holds a board side-bump 19 and a chip side-bump 16 substantially at the same height and a second process which joins a large metal foil 20 which covers every board side-bump 19 and every chip side-bump 16 which every board side-bump 19 and every chip side-bump 16 and a third process which leaves a belt-shaped portion which connects each board side-bump to each chip side-bump 16 out of the metal foil 20 and eliminates the other metal foil 20 than in the portion, thereby forming a plurality of lead wires 24 which connect an area between both bumps 19 and 16.
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