MOUNTING METHOD OF SEMICONDUCTOR LIGHT EMITTING DEVICE

Japanese Patent JP3938350

B2

PROBLEM TO BE SOLVED: To simplify wiring work by reducing the number of wire bonding for the mounted member of a semiconductor light emitting device.
SOLUTION: The semiconductor light emitting device 1 is provided with an element main body 2 and a sub-mount member 11. The element main body 2 is constituted so that respective semiconductor layers 4, 5 and 6 are formed on the surface of a transparent insulating substrate 3, and an N-side electrode 9 as well as a P-side electrode 10 are formed on predetermined places of respective layers. The sub-mount member 11 is provided with an auxiliary N-side electrode layer 15 formed so as to be insulated to the surface of a conductive substrate 12, and an auxiliary P-side electrode 14 formed so as to be conducted. The sub-mount member 11 and the element main body 2 are constituted integrally so that the surface side of the sub-mount member 11 is opposed to the surface side of the element main body 2 mutually, and the N-side electrode layer 15 is conducted while the auxiliary P-side electrode layer 14 is conducted to the P-side electrode 10. The semiconductor light emitting device 1, constituted in such a manner as described above, is mounted on the mounted member 16.

JP2003174190	LIGHT-EMITTING SEMICONDUCTOR DEVICE
JPS5844780	SEMICONDUCTOR LIGHT EMITTING ELEMENT
WO/2018/038927	HIGH LIGHT-EXTRACTION EFFICIENCY (LEE) LIGHT-EMITTING DIODE (LED)

Yukio Shakuda

JP2002293997A

June 27, 2007

August 18, 1994

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ROHM Co., Ltd.

H01L33/20; H01L33/32; H01L33/38; H01L33/62; (IPC1-7): H01L33/00

JP56112768A
JP5870584A
JP58207682A
JP6381992A
JP864872A
JP6177434A
JP6177429A
JP5243610A
JP1268074A

Minoru Yoshida
Tatsuya Tanaka
Hiroshi Furusawa

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