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Title:
MOUNTING METHOD FOR SURFACE ACOUSTIC WAVE CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPH0629773
Kind Code:
A
Abstract:

PURPOSE: To prevent short-circuit to a ground conductor at the time of mounting a surface acoustic wave circuit device.

CONSTITUTION: The bottom of a TO can of a surface acoustic wave circuit device 1 is closely brought into contact with a common ground conductor 6 formed on one face of a dielectric substrate 5, and attaching holes 7 and through holes of insulating layers 8 on side faces of these holes 7 are provided from the other face of the dielectric substrate 5 to the bottom side of the TO can 2, and input/output pins 3 and 4 are inserted through them and are bent and are soldered to conductor patterns 9A and 9B for connection formed on the other face of the dielectric substrate 5.


Inventors:
SUZUKI KAZUTOSHI
KUROSAWA KAZUHITO
Application Number:
JP18344592A
Publication Date:
February 04, 1994
Filing Date:
July 10, 1992
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H03H3/08; H03H9/25; H05K1/02; H05K1/18; H05K3/00; H05K3/34; (IPC1-7): H03H9/25; H03H3/08
Attorney, Agent or Firm:
Ogawa Katsuo



 
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