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Patent Searching and Data


Title:
MOUNTING METHOD FOR SURFACE MOUNTING TYPE SEMICONDUCTOR COMPONENT
Document Type and Number:
Japanese Patent JPH04320390
Kind Code:
A
Abstract:

PURPOSE: To improve a thermal impact resistance life of a connecting part by setting thermal expansion coefficients of a printed board at an X-axis and a Y-axis to a predetermined value or less.

CONSTITUTION: Thermal expansion coefficients of a printed board at an X-axis and a Y-axis are set to 1.0×10-5/°C or less. A silicon chip 1 in which a circuit is formed on its surface, is adhered to a lead frame 4 with polyimide resin-based conductive adhesive 3. Then, it is sealed with epoxy resin-based sealing material 5. A size of a sealed package is 7.1×22.0mm, 1.2mm thick. A projecting area of the chip to that of the package is 68%, and total sum of the thicknesses of the chip and the frame to the entire thickness of the package is 54%. Then, a resin-sealed semiconductor device is mounted on a printed board manufactured by impregnating glass fiber 7 with epoxy resin 8 and inorganic fine particles 9, by soldering.


Inventors:
Ogata, Masaji
Eguchi, Kuniyuki
Hozoji, Hiroyuki
Amagi, Shigeo
Application Number:
JP1991000088117
Publication Date:
November 11, 1992
Filing Date:
April 19, 1991
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
D03D25/00; H05K1/03; H05K1/18; H05K1/02; H05K3/30; (IPC1-7): D03D25/00; H05K1/03; H05K1/18