Title:
MOUNTING METHOD
Document Type and Number:
Japanese Patent JP3405269
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the bent of a board without deteriorating its connective reliability, by determining the inflection-point temperature of the elastic modulus of a bonding agent which is obtained by the relation of its elastic modulus to its temperature after its hardening, and by making not lower than this inflection-point temperature the temperature of a stage generated when subjecting the board to a thermo-compressive bonding.
SOLUTION: By determining previously the correspondent temperature of a thermosetting type bonding agent 2 to the inflection point of its elastic modulus, the temperature of a stage 4 generated when subjecting a board 1 to a thermo-compressive bonding is made not lower than the correspondent temperature of the bonding agent to the inflection point. When subjecting the board 1 to the thermo-compressive bonding, the board 1 and its mounting part are pressed via the thermosetting type bonding agent 2 by the pressure per one bump of 100-2000 Kg/cm2, and are subjected to a necessary heating for hardening the thermosetting type bonding agent 2. Hereupon, from the view-point of the deformation quantity of the board 1 generated after its thermo-compressive bonding, the board 1 having an elastic modulus (at ordinary temperature) not larger than 100 Gpa and a thickness not larger than 1.0 mm is used. Also, as the elastic modulus (at ordinary temperature) of the thermosetting type bonding agent 2 generated after its hardening, from the view-points of its current-application reliability and its continuity resistance, the one not smaller than 1.0 Gpa is used. As a result, the bent of the board 1 can be prevented without deteriorating its connective reliability.
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Inventors:
Yukio Yamada
Hiroyuki Fujihira
Motohide Takeichi
Hiroyuki Fujihira
Motohide Takeichi
Application Number:
JP11865199A
Publication Date:
May 12, 2003
Filing Date:
April 26, 1999
Export Citation:
Assignee:
Sony Chemical Co., Ltd.
International Classes:
H05K3/32; H01L21/56; H01L21/60; (IPC1-7): H05K3/32; H01L21/60
Domestic Patent References:
| JP1187429A |
Attorney, Agent or Firm:
Noboru Tajime (1 person outside)