Title:
MOUNTING STRUCTURE OF BALL GRID ARRAY PACKAGE, AND METHOD OF MOUNTING AND REMOVING THE SAME
Document Type and Number:
Japanese Patent JP2004186287
Kind Code:
A
Abstract:
To make unnecessary useless space and to easily remove a ball grid array package (BGA) after the mounting under the condition of low thermal stress.
In the mounting structure of BGA1, the ball grid array package (BGA) 1 and a substrate 2 are connected via a plurality of solder balls 11. Moreover, a repair sheet 3 is also arranged between the BGA1 and a substrate 2.
Inventors:
OYAMA KAZUYUKI
Application Number:
JP2002349372A
Publication Date:
July 02, 2004
Filing Date:
December 02, 2002
Export Citation:
Assignee:
NEC INFRONTIA CORP
International Classes:
H05K3/34; H05K1/18; (IPC1-7): H05K1/18; H05K3/34
Attorney, Agent or Firm:
Yosuke Goto
Kenho Ikeda
Kenho Ikeda