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Title:
MOUNTING STRUCTURE OF BUILT-IN DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2004234740
Kind Code:
A
Abstract:

To provide the mounting structure of a built-in device capable of preventing excessive shocks on the built-in device installed in a casing, and an electronic device employing the mounting structure.

A reinforcing member 3 is formed by setting a second space s2 with a casing 2 through an interpolation member 6 in the bottom of the casing 2 equivalent to the installing place of a built-in device 1, an attaching tool 4 extended in a height direction is fixed to the reinforcing member 3, and the built-in device 1 is fixed in the reinforcing member 3 by the attaching tool 4 and installed in the casing 2. A first shock absorbing member 9 is disposed in a first space s1 between the built-in device 1 and the reinforcing member 3, and a second shock absorbing member 10 is disposed in the second space s2 between the reinforcing member 3 and the bottom of the casing 2.


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Inventors:
NAGAI MASATAKE
MICHIWAKI YUTAKA
Application Number:
JP2003020901A
Publication Date:
August 19, 2004
Filing Date:
January 29, 2003
Export Citation:
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Assignee:
SONY CORP
International Classes:
H05K7/12; G06F1/16; G11B25/04; G11B33/08; G11B33/12; (IPC1-7): G11B33/08; G06F1/16; G11B25/04; G11B33/12; H05K7/12
Attorney, Agent or Firm:
Yasuo Iisaka