PURPOSE: To cope sufficiently with a three-dimensional mounting form even if its form is complicated because of miniaturization of an electronic apparatus by making its apparatus itself have cooling structure and soldering the input/ output terminal of electronic parts having each large thermal capacitance to electrodes in flexible print circuits.
CONSTITUTION: A silicon steel plate 6 having the coefficient of expansion which is closer than that of an alumina plate is fixed firmly to an aluminum plate by means of screw-fastening in order to absorb differences in coefficients of expansion between the alumina plate of an electronic circuit plate 1 and the aluminum plate 8 for radiation and then, efficient cooling and highly reliable connection of them are realized by fixing sn interval between the alumina plate and the silicon steel plate only with adhesives 2. Further, the input/output terminal of electronic parts 1 having each large thermal capacitance snd electrodes in flexible print circuit plates 5 are combined by soldering. This configuration copes flexibly with a three dimensional mounting in an electronic apparatus which is complicated by miniaturizing the above apparatus.
SONODA HIDEAKI
SAITO MASARU
NOMOTO YASUNARI
TAMARU SHIGEHIKO
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