Title:
MOUNTING STRUCTURE OF ELECTRONIC COMPONENT AND MOUNTING METHOD OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2016111183
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent dust, moisture, corrosive gas, and the like, from flowing between an electronic component and a printed board from a gas vent, after mounting the electronic component, even if the printed board is constituted to have a gas vent.SOLUTION: A mounting structure of electronic component includes a printed board having a terminal insertion hole, an electronic component having a connection terminal, and mounted on the printed board by inserting the connection terminal into the terminal insertion hole and soldering, a gas vent formed in the printed board at a part facing the electronic component, and a sealing member provided to seal the gas vent after mounting the electronic component.SELECTED DRAWING: Figure 1
Inventors:
FUJITA KENJI
Application Number:
JP2014246930A
Publication Date:
June 20, 2016
Filing Date:
December 05, 2014
Export Citation:
Assignee:
TOSHIBA SCHNEIDER INVERTER
International Classes:
H05K1/18; H01G2/02; H01G2/06
Attorney, Agent or Firm:
Patent Business Corporation Sato International Patent Office
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