Title:
MOUNTING STRUCTURE OF ELECTRONIC COMPONENT FOR TIRE
Document Type and Number:
Japanese Patent JP2004299535
Kind Code:
A
Abstract:
To provide a mounting structure of an electronic component for a tire whereby a case of the electronic component attached on a rim well part is prevented from being broken during work for attaching and detaching the electronic component to and from a wheel of the tire.
In the structure for mounting the electronic component housed in the case on the rim well part in a tire air chamber, a position fixing state of the case is released before the case is broken by external force along the tire radial direction. When a sensor case 1 having the electronic component 3 in the case 2 is attached on a well part W of a rim R, for example, the mounting force of the case 2 to the well part W is made to be smaller than breaking stress of the case 2.
Inventors:
SHIMURA KAZUHIRO
Application Number:
JP2003094870A
Publication Date:
October 28, 2004
Filing Date:
March 31, 2003
Export Citation:
Assignee:
YOKOHAMA RUBBER CO LTD
International Classes:
B60C23/04; G01L17/00; (IPC1-7): B60C23/04
Attorney, Agent or Firm:
Shinichi Ogawa
Takashi Noguchi
Kazuhiko Saishita
Takashi Noguchi
Kazuhiko Saishita
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