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Title:
MOUNTING STRUCTURE OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2010246075
Kind Code:
A
Abstract:

To provide a mounting structure of an electronic component settable at high impedance in a high-frequency band while keeping low impedance in a low-frequency band.

A capacitor 10 and a bead inductor 20 are mounted to be connected in series to each other between power lines 1, 2. According to this mounting structure, the resistance component of the bead inductor 20 acts as equivalent series resistance of the capacitor, and he resistance component of the bead inductor 20 is formed with the sum of a D.C. resistance component and loss increasing in the high-frequency band, whereby impedance in the high-frequency band is increased, and high-frequency noise is preferably removed. Since the inductor component of the bead inductor 20 functions in the low-frequency band, impedance in the low-frequency band is kept at low, and low-frequency noise is absorbed because the capacitor 10 is mounted.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
TOGASHI MASAAKI
HIROSE KIICHIRO
Application Number:
JP2009130584A
Publication Date:
October 28, 2010
Filing Date:
May 29, 2009
Export Citation:
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Assignee:
TDK CORP
International Classes:
H03H7/01
Domestic Patent References:
JPH0464824U1992-06-04
JPH06325977A1994-11-25
JP2008028518A2008-02-07
JPH04165606A1992-06-11
JPH10208963A1998-08-07
JPH06333744A1994-12-02
JPH11186045A1999-07-09
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Takashi Mikami
Yasunori Ishizaka