Title:
電子部品の実装構造
Document Type and Number:
Japanese Patent JP4238671
Kind Code:
B2
Inventors:
Hirokazu Imai
Masashi Togakawa
Ryo Shinobi
Yuji Otani
Takashi Nagasaka
Masashi Togakawa
Ryo Shinobi
Yuji Otani
Takashi Nagasaka
Application Number:
JP2003296259A
Publication Date:
March 18, 2009
Filing Date:
August 20, 2003
Export Citation:
Assignee:
株式会社デンソー
International Classes:
C09J9/02; H05K3/32; C09J11/04; C09J127/12; C09J177/00; C09J179/08; C09J183/04
Domestic Patent References:
| JP6177278A |
Foreign References:
| WO1998003047A1 |
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno
Takahiro Miura
Fumihiro Mizuno