Title:
電子機器の取付構造
Document Type and Number:
Japanese Patent JP7302589
Kind Code:
B2
Abstract:
To suppress damage of electronic equipment due to heat and vibration.SOLUTION: A mounting structure for mounting electronic equipment on a catalyst casing 1 includes: bosses 11,12 having a hollow structure in which a base end part is fixed to the catalyst casing; and a tabular first bracket 13 which is fixed to a tip part of the boss, and on which the electronic equipment is mounted. Compared to the case where the first bracket is directly fixed to the catalyst casing, the heat quantity transmitted to the first bracket from the catalyst casing can be reduced. The boss has a hollow structure, so that the heat transmission amount is made to be smaller, rigidity is secured, and resonance of the first bracket is suppressed.SELECTED DRAWING: Figure 1
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Inventors:
Hiroyuki Watanabe
Isao Ohara
Yusuke Shibuya
Satoshi Sasaki
Isao Ohara
Yusuke Shibuya
Satoshi Sasaki
Application Number:
JP2020219122A
Publication Date:
July 04, 2023
Filing Date:
December 28, 2020
Export Citation:
Assignee:
Isuzu Motors Limited
International Classes:
F02B77/00; B60K5/00; F01N3/24
Domestic Patent References:
JP9311117A | ||||
JP2015008581A | ||||
JP2018105283A | ||||
JP2017071943A |
Attorney, Agent or Firm:
Haruhisa Kinutani
Hiroyuki Pillaryama
Hiroyuki Pillaryama