MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

Title:

MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2000286284

Kind Code:

A

Abstract:

To provide a mounting structure of a semiconductor device which prevents the electric shortage with an adjacent bump caused by the thermal transformation of a bump at facedown mounting of the semiconductor device.

For this mounting structure, a plurality of electrodes 22 formed on a semiconductor device are connected electrically to the connection patterns 32 made on a substrate 30 via a plurality of bumps 23, and nonconductive bulkhead members 40 are provided between a plurality of pumps, and form example ceramic small balls 41 smaller than the bumps are used for the bulkhead members. Moreover, a hole for allowing the head face for junction of the bump to pass through is made at the bulkhead member, and a film overlaid on the electrode face of the semiconductor device is used for it.

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Inventors:

AKAMATSU TOSHIMASA
UNO YUJI
OTA TAKASHI
YUKIMATSU KIKO

Application Number:

JP9228499A

Publication Date:

October 13, 2000

Filing Date:

March 31, 1999

Export Citation:

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Assignee:

FUJITSU TEN LTD

International Classes:

H01L21/60; (IPC1-7): H01L21/60

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