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Patent Searching and Data


Title:
MOUNTING STRUCTURE OF SURFACE ELASTIC WAVE ELEMENT AND MOUNTING THEREOF
Document Type and Number:
Japanese Patent JP2000058593
Kind Code:
A
Abstract:

To enable miniaturization of a mounting structure to make it almost the same size as a surface elastic wave element itself.

A surface acoustic wave element 1 has a mounting structure wherein the functional surface 1a of the element 1 opposes the mounting surface 6a of a wiring board 6 with the element 1 to be mounted thereon, and a gap between the functional surface 1a and the mounting surface 6a is sealed with a resin while keeping an oscillation space 9 between the propagation area of vibration of the functional surface 1a and the mounting surface 6a. The resin used for sealing is an isotropic electrically conductive resin 8. And the vibration space 9 is constructed from a space formed by the isotropic electrically conductive resin 8.


Inventors:
TANAKA TAKASHI
Application Number:
JP21883698A
Publication Date:
February 25, 2000
Filing Date:
August 03, 1998
Export Citation:
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Assignee:
NEC CORP
International Classes:
H01L21/60; H03H3/08; H03H9/05; H03H9/25; (IPC1-7): H01L21/60; H03H9/25
Attorney, Agent or Firm:
Yosuke Goto (1 person outside)