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Title:
MOUNTING STRUCTURE OF TEMPERATURE SENSING PART AND THERMAL FLOWMETER USING IT
Document Type and Number:
Japanese Patent JP3475579
Kind Code:
B2
Abstract:

PURPOSE: To provide the mounting structure, of a temperature sensing part, which reduces the error of an indicated value on a temperature sensing part and abates manufacturing costs and to provide a thermal flowmeter using the mounting structure.
CONSTITUTION: An intake-air temperature sensor 30 is arranged and installed inside a main passage 2 so as to be exposed to air which flows in the main passage 2. This is because heat discharged from a circuit case situated on the rear side of the intake- air temperature sensor 30 is transferred to intake air. A thermosensitive element 31 at the intake-air temperature sensor 30 is constituted in such a way that its circumference is not covered with a sensor housing 30a which is molded integrally with a rib 12 and that it is exposed toward the upstream direction of the intake air inside the main passage 2. Since the thermosensitive element 31 is situated on the upstream side of the intake air from the circuit case in a circuit part 13, the intake air which is warmed by heat generated from the circuit part 13 does not come into contact with the thermosensitive element 31. Thereby, the thermosensitive element 31 can dissipate heat by means of the intake air which flows into from the tip part direction of the thermosensitive element 31 exposed inside the main passage 2.


Inventors:
Minoru Kondo
Hideki Koyama
Tomoyuki Takiguchi
Application Number:
JP15348895A
Publication Date:
December 08, 2003
Filing Date:
June 20, 1995
Export Citation:
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Assignee:
株式会社デンソー
International Classes:
F02M35/10; G01F1/684; G01F1/68; G01F1/69; (IPC1-7): G01F1/69; G01F1/684
Domestic Patent References:
JP682285A
Attorney, Agent or Firm:
Masaki Hattori