To provide a mounting structure for mounting a two-terminal capacitor on a substrate which can deal with reduction in the size and profile of electronic components, while exhibiting the characteristics as a capacitor sufficiently.

A capacitor 11 is covered with a shield case 28 and mounted, as a bypass capacitor, on a circuit board 21 while standing vertically. A hot electrode 13a of the capacitor 11 is connected electrically, by soldering, with a hot conductor path 25 formed on the surface of the circuit board 21. A ground electrode 13b of the capacitor 11 is connected electrically with the inner wall of a shield case 28 located above the hot conductor path 25 connected with the hot electrode 13a electrically. This electrical connection is carried out by bonding the ground electrode 13b to the inner wall of a shield case 28 by means of a conductive adhesive 32, and fixing the ground electrode 13b in place.