Title:
MOUNTING SUBSTRATE INCORPORATING ELECTRONIC PARTS, AND SEMICONDUCTOR PACKAGE USING THE SAME
Document Type and Number:
Japanese Patent JP2001298273
Kind Code:
A
Abstract:
To reduce electronic parts occupying about thirty percent of surface mounted parts loaded on a build-up substrate and to improve mounting density.
In a core substrate 110, an insulating layer and a metallic wiring layer are alternately laminated, an electronic part 21 is arranged in a spot facing hole installed at the same time as the formation of a through hole 3 and the electronic part 21. The conductor part 26 of the through hole 3 and the metallic wiring layer are electrically connected in the plating process of the trough hole 3.
Inventors:
SHIGI HIDETAKA
HASEBE TAKEHIKO
MATSUZAKI EIJI
KITAMURA NAOYA
KYOI MASAYUKI
MORI TERUTAKA
USHIFUSA NOBUYUKI
KATO TERUTAKE
HASEBE TAKEHIKO
MATSUZAKI EIJI
KITAMURA NAOYA
KYOI MASAYUKI
MORI TERUTAKA
USHIFUSA NOBUYUKI
KATO TERUTAKE
Application Number:
JP2000121060A
Publication Date:
October 26, 2001
Filing Date:
April 17, 2000
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H05K3/32; H01L23/12; H01L25/00; H05K1/18; H05K3/46; (IPC1-7): H05K3/46; H01L23/12; H01L25/00; H05K1/18; H05K3/32
Attorney, Agent or Firm:
Sakuta Yasuo