Title:
MOUNTING SUBSTRATE AND MOUNTING SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2023099005
Kind Code:
A
Abstract:
To provide a mounting substrate and a manufacturing method of the same that suppress the occurrence of positional displacement of elements.SOLUTION: A mounting substrate includes a housing substrate 10 including a first surface 11 and a second surface 12 located on the opposite side of the first surface 11, provided with a recess 13 on the first surface side, and including an organic material, an element 50 located in a recess 13 of the housing substrate 10 and having a terminal 51, an insulating layer 20 that at least partially covers the housing substrate 10 and the element 50 on the first surface 11 side and is at least partially positioned in a gap between the wall surface 132 of the recess 13 of the housing substrate 10 and the element 50, and a conductive layer 25 having a first portion 26 located on the insulating layer 20 and a second portion 27 penetrating the insulating layer 20 and electrically connecting the first portion 26 and the terminal 51 of the element 50.SELECTED DRAWING: Figure 2
Inventors:
KURAMOCHI SATORU
Application Number:
JP2023065181A
Publication Date:
July 11, 2023
Filing Date:
April 12, 2023
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H01L23/12; H01L23/28; H01L23/29; H05K3/46
Attorney, Agent or Firm:
Manabu Miyajima
Yukihiro Hotta
Kazuo Okamura
Yukihiro Hotta
Kazuo Okamura
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