Title:
MOVABLE ELEMENT, AND SEMICONDUCTOR DEVICE, MODULE AND ELECTRONIC DEVICE INCORPORATING MOVABLE ELEMENT
Document Type and Number:
Japanese Patent JP2007012558
Kind Code:
A
Abstract:
To provide a movable element which can control an generation of a stiction and a semiconductor device, a module and an electronic device using the movable element.
The movable element is provided on a semiconductor base plate 1 with a signal circuit 11 to transfer a signal, a switching part 12 to make a mechanical switching of the signal circuit 11, and changing part 13 to change the switching part 12 and hold a condition after changing of the switching part 12. The above switching part 12 has a pair of a movable piece 12B and a fixed piece 12A positioned facing each other and has a contact point 12B-2 of an approximate spherical shape at least on one facing surface of the movable piece 12B and the fixed piece 12A of the switching part 12.
Inventors:
Akiba, Akira
Application Number:
JP2005000195089
Publication Date:
January 18, 2007
Filing Date:
July 04, 2005
Export Citation:
Assignee:
SONY CORP
International Classes:
H01H1/06; B81B3/00; H01H37/52; H01H53/015; H01H57/00; H01H59/00; H01L41/09
