To provide a movable element facilitating a manufacturing process, never disturbing reduction of a package size, and having low voltage/low power consumption to an extent allowing itself to be integrally formed with a low voltage/low power consumption-based element; to provide a semiconductor device with the movable element incorporated therein; to provide a module; and to provide an electronic apparatus.

This movable element is provided, on a semiconductor substrate 10, with: a signal line 11 for transmitting a signal; a connection/disconnection part 12 for mechanically connecting and disconnecting the signal line; switching parts 13 for switching the connection/disconnection part 12; and holding parts 14 for holding a state after the switching of the connection/disconnection part 12. Each switching part 13 has a movable piece 13B and the connection/disconnection part 12 and each holding part 14 have a set of stationary pieces 12A and 14A and movable pieces 12B and 14B arranged oppositely to each other, respectively; and the movable piece 14B of the holding part 14 is connected to the respective movable pieces 12B and 13B of the connection/disconnection part 12 and the switching part 13 through elastic parts 15.