Title:
基板プロセス装置でのエッジ堆積を制御する移動可能リング
Document Type and Number:
Japanese Patent JP5073631
Kind Code:
B2
Abstract:
A substrate processing apparatus comprising a processing chamber in which a substrate support (16) is located. The substrate support, which is in the form of a heater pedestal, has a surface (22) dimensioned to receive the substrate (23), and is circumscribed by a removable purge ring (24) which defined an annulus (80) between itself and the pedestal. At the outer edge of the pedestal is a purge gas manifold (26), in the form of a cavity between the purge ring and the pedestal. The lower end of the manifold is sealed by means of a mechanical seal that is formed at process temperature as the pedestal (16) expands from heating and comes into contact with the purge ring's lower edge (84). The upper end of the manifold opens into the annulus (80) defined by the purge ring and the pedestal. The manifold is arranged so that during processing, purge gas is injected into the manifold and projected toward the edge of a substrate received on the surface of the pedestal. This gas moves upwards through the annulus defined between the purge ring and the substrate support. Consequently, processing gas is prevented from contacting the extreme edge portion of the substrate. This reduces unwanted deposition on the peripheral edge and lower surface of the substrate.
Inventors:
Salvador P. Umotoi
Alan Ev. Morrison
Karl A. Ritau
Richard A. Marsh
Lawrence Chan-Rai Ray
Alan Ev. Morrison
Karl A. Ritau
Richard A. Marsh
Lawrence Chan-Rai Ray
Application Number:
JP2008256594A
Publication Date:
November 14, 2012
Filing Date:
October 01, 2008
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
C23C16/44; C23C16/455; C23C16/458; C23C16/46; H01L21/00; H01L21/205; H01L21/28; H01L21/285; H01L21/68; H01L21/683; H01L21/687
Domestic Patent References:
| JP6306615A | ||||
| JP5339734A | ||||
| JP4233221A | ||||
| JP7058016A | ||||
| JP9509534A |
Attorney, Agent or Firm:
Koichi Tsujii
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi
Hidehiko Ichikawa
Ikeda adult
Tosuke Yosuke
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi
Hidehiko Ichikawa
Ikeda adult
Tosuke Yosuke