MULTI-CHIP MODULE AND MANUFACTURE THEREOF

Title:

MULTI-CHIP MODULE AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JPH07193184

Kind Code:

A

Abstract:

PURPOSE: To improve the productivity of a multi-chip module and the stability of its operation by using a chip mount board that is accompanied by a base board during its manufacturing process.

CONSTITUTION: An adhesive layer 11 is formed on a base board 10. Wiring layers 13, 16 and 18 isolated from one another by insulating layers 12, 15, 17, 19, 21 and 23 are formed one over another above the adhesive layer 11 so as to provide a chip mount board 26. Holes 27 extending to the adhesive layer 11 through the insulating layers 12, 15, 17, 19, 21 and 23 are opened. An etching solution 28 for removing the adhesive layer 11 is applied through the holes 27 so that the chip mount board can be separated from the base board. Then, semiconductor chips are mounted on the board 26.

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Inventors:

KURAMOCHI TOSHIYUKI

Application Number:

JP33335493A

Publication Date:

July 28, 1995

Filing Date:

December 27, 1993

Export Citation:

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Assignee:

FUJITSU LTD

International Classes:

H01L21/48; H01L23/538; H01L21/68; H05K3/00; H05K1/02; H05K3/46; (IPC1-7): H01L23/522

Attorney, Agent or Firm:

Tadahiko Ito

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