Title:
MULTI-CHIP MODULE
Document Type and Number:
Japanese Patent JP3405520
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable ICs to be integrated into a multi-chip module by a method wherein a first chip is equipped with a first and a second circuit part which are connected together with a signal conductor, the first and second chip are connected direct together with the signal conductor of the first chip, and the second circuit part of the first chip is bypassed.
SOLUTION: ICs 111 and 121 are equipped with signal processing circuits 112 and 122 (first circuit part) respectively, and furthermore the ICs 111 and 121 are provided with conductor IC buses 113 and 123 respectively so as to store data in common. Moreover, the ICs 111 and 121 are provided with a serial input/output port (second circuit part) connected to the IC buses 113 and 123 respectively. At this point, a multi-chip module 200 is furthermore equipped with a lead 230 (mutual connecting means) which connects the IC bus 113 of the IC 111 to the IC bus 123 of the IC 121. By this setup, the buffers of a multiplex circuit and the ICs 111 and 121 can be bypassed.
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Inventors:
Taddus John Gabara
King Lien Thai
King Lien Thai
Application Number:
JP11419098A
Publication Date:
May 12, 2003
Filing Date:
April 09, 1998
Export Citation:
Assignee:
Lucent Technologies, Inc.
International Classes:
H01L23/50; H01L23/538; H01L25/065; (IPC1-7): H01L23/538
Domestic Patent References:
| JP6189658A |
Attorney, Agent or Firm:
Masao Okabe (10 outside)
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